JPS6314467Y2 - - Google Patents
Info
- Publication number
- JPS6314467Y2 JPS6314467Y2 JP1983016620U JP1662083U JPS6314467Y2 JP S6314467 Y2 JPS6314467 Y2 JP S6314467Y2 JP 1983016620 U JP1983016620 U JP 1983016620U JP 1662083 U JP1662083 U JP 1662083U JP S6314467 Y2 JPS6314467 Y2 JP S6314467Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal conductor
- ceramic substrate
- semiconductor device
- terminal
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE8203300.5 | 1982-02-08 | ||
| DE8203300 | 1982-02-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58131633U JPS58131633U (ja) | 1983-09-05 |
| JPS6314467Y2 true JPS6314467Y2 (en]) | 1988-04-22 |
Family
ID=30005759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1662083U Granted JPS58131633U (ja) | 1982-02-08 | 1983-02-07 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58131633U (en]) |
-
1983
- 1983-02-07 JP JP1662083U patent/JPS58131633U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58131633U (ja) | 1983-09-05 |
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